Extreme Wind Cooling Semiconductor Heat Dissipation Gaming Phone Original Heat Dissipation Clip Game Back Cooling

Technical Parameters:1. The refrigerator semiconductor intelligent physics cools rapidly.2. The retractable buckle design can be used in 4-6.5" mobile phones.3. Wired radiator with Type-C interface.4. Effectively reduce the heat energy of the mobile phone andmake the mobile phone use more smoothly.5. Say goodbye to the lag in the game due to heat,and make the mobile game process more smooth;6. Alloy heat dissipation, intelligent refrigeration,7. Non-slip foot pads, colorful lights in seven colors. Product Parameters:1) Wire interface type: USB/Type-C2) Engine type (optical/laser): wired3) Cable Wire length: 1.5M4) Temperature: the lowest cooling temperature is -5°,working time is 5 minutes to 10 minutes5) Working voltage: DC 5V6) Working current: DC 1A-2A7) Fan speed: 4200±10% revolution8）Maximum size of stretching mode: length 102mm*width 58mm*height 38mm9）The maximum working width is 85mm. The minimum working width is 65mm (the width of the product attached to the mobile phone)Package Includes:1 x Mobile phone radiator1 x Type-C power cord1 x Anti-scratch silicone sheet1 x User's manual Instructions:①The telescopic buckle design is 4-6.5 incheswide mobile phone clip.②Plug in the power cord and it is ready to use.